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ELECTROLYTIC COPPER FOIL, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, PRODUCTION METHOD THEREFOR, ELECTRONIC DEVICE, AND PRODUCTION METHOD THEREFOR
ELECTROLYTIC COPPER FOIL, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, PRODUCTION METHOD THEREFOR, ELECTRONIC DEVICE, AND PRODUCTION METHOD THEREFOR
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机译:电解铜箔,覆铜箔板,印刷线路板,其制备方法,电子设备及其制备方法
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摘要
An electrolytic copper foil having a glossy surface and a deposition surface. This electrolytic copper foil has a roughened layer on the glossy surface side thereof. The root mean square height Sq of the glossy surface is no more than 0.550 µm. The deposition surface side fulfills at least one condition among the following: (a) the surface roughness Sa is at least 0.115 µm; (b) the root mean square height Sq is at least 0.120 µm; (c) the maximum peak height Sp is at least 0.900 µm; (d) the maximum valley depth Sv is at least 0.600 µm; the maximum height Sz is at least 1.500 µm; (f) the kurtosis Sku is 2.75–4.00; and (g) the skewness Ssk is 0.00–0.35.
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