首页> 外国专利> ELECTROLYTIC COPPER FOIL, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, PRODUCTION METHOD THEREFOR, ELECTRONIC DEVICE, AND PRODUCTION METHOD THEREFOR

ELECTROLYTIC COPPER FOIL, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, PRODUCTION METHOD THEREFOR, ELECTRONIC DEVICE, AND PRODUCTION METHOD THEREFOR

机译:电解铜箔,覆铜箔板,印刷线路板,其制备方法,电子设备及其制备方法

摘要

An electrolytic copper foil having a glossy surface and a deposition surface. This electrolytic copper foil has a roughened layer on the glossy surface side thereof. The root mean square height Sq of the glossy surface is no more than 0.550 µm. The deposition surface side fulfills at least one condition among the following: (a) the surface roughness Sa is at least 0.115 µm; (b) the root mean square height Sq is at least 0.120 µm; (c) the maximum peak height Sp is at least 0.900 µm; (d) the maximum valley depth Sv is at least 0.600 µm; the maximum height Sz is at least 1.500 µm; (f) the kurtosis Sku is 2.75–4.00; and (g) the skewness Ssk is 0.00–0.35.
机译:一种具有光泽表面和沉积表面的电解铜箔。该电解铜箔在其光泽表面侧具有粗糙化层。光滑表面的均方根高度Sq不大于0.550 µm。沉积表面侧满足以下条件中的至少一种条件:(a)表面粗糙度Sa为至少0.115μm; (b)均方根高度Sq至少为0.120 µm; (c)最大峰高Sp至少为0.900μm; (d)最大谷底深度Sv至少为0.600μm;最大高度Sz至少为1.500μm。 (f)峰度Sku为2.75–4.00; (g)偏度Ssk为0.00–0.35。

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