WAFER LEVEL INTEGRATED OPTICS IN PACKAGING FOR IMAGING SENSOR APPLICATION

摘要

Conventional optical lens assembly typically require a capping window, which is expensive, to protect the optical sensor. Also, each conventional optical lens assembly is discretely assembled, and thus incurs additional costs. To address these and other disadvantages, it is proposed to assemble a plurality of imaging sensors, a plurality of spacers, and a plurality of lenses at a panel. The resulting lens assembly array can be individualized into separate lens assemblies.