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PLASMA ENHANCED CVD WITH PERIODIC HIGH VOLTAGE BIAS
PLASMA ENHANCED CVD WITH PERIODIC HIGH VOLTAGE BIAS
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机译:周期性高压偏置的等离子体增强CVD
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摘要
Embodiments include a method of processing a substrate. In an embodiment, the method comprises flowing one or more source gasses into a processing chamber, and inducing a plasma from the source gases with a plasma source that is operated in a first mode. In an embodiment, the method may further comprise biasing the substrate with a DC power source that is operated in a second mode. In an embodiment, the method may further comprise depositing a film on the substrate.
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