首页> 外国专利> METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD FOR INVERTER OF WASHING MACHINE

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD FOR INVERTER OF WASHING MACHINE

机译:洗衣机变频器印刷电路板的制造方法

摘要

An object of the present invention is to provide a method of manufacturing a printed circuit board for an inverter of a washing machine, which can reduce power consumption, have excellent durability, and can achieve quietness due to noise reduction. To achieve the above object, a method of manufacturing a printed circuit board for an inverter of a washing machine inverter according to the present invention includes: a first step (S100) of preparing an epoxy layer (100) having a copper foil (110) stacked on both sides; a second step (S200) of forming a through hole (A) penetrating upper and lower surfaces and a component hole (B); a third step (S300) of forming a copper plating layer (300) on an electroless copper plating layer (200) after forming the electroless copper plating layer (200) on an inner surface of the through hole (A), an inner surface of the component hole (B) and the copper foil (110); a fourth step (S400) of forming a hole land of the through hole (A), a hole land of the component hole (B), a circuit and a pad by performing a circuit forming process on the copper foil (110), the electroless copper plating layer (200) and an electrolytic copper plating layer 300; a fifth step (S500) of printing the inner surface and the hole land of the through hole (A), the inner surface and the hole land of the component hole (B) and an area other than the pad with a solder resist ink (400); and a sixth step of applying an organic solderability preservative (OSP) coating (500) to the inner surface and the hole land of the through hole (A), the inner surface and the hole land of the component hole (B) and the pad.
机译:本发明的目的是提供一种用于洗衣机的逆变器的印刷电路板的制造方法,该方法可以减少功耗,具有优异的耐久性并且由于降低噪音而可以实现静音。为了实现上述目的,根据本发明的用于洗衣机逆变器的逆变器的印刷电路板的制造方法包括:制备具有铜箔(110)的环氧层(100)的第一步(S100)。两侧堆叠;第二步骤(S200),形成贯穿上表面和下表面的通孔(A)和部件孔(B);第三步骤(S300),在通孔(A)的内表面,通孔(A)的内表面上形成化学镀铜层(200)之后,在化学镀铜层(200)上形成镀铜层(300)。组件孔(B)和铜箔(110);第四步骤(S400),其通过在铜箔(110)上执行电路形成工艺而形成通孔(A)的孔焊盘,部件孔(B)的孔焊盘,电路和焊盘,化学镀铜层(200)和电解镀铜层300。第五步骤(S500),用阻焊油墨印刷通孔(A)的内表面和孔焊盘,部件孔(B)的内表面和孔焊盘以及除焊盘以外的区域( 400);第六步骤,在通孔(A)的内表面和孔焊盘,部件孔(B)的内表面和孔焊盘以及焊盘上涂覆有机可焊性(OSP)涂层(500)。 。

著录项

  • 公开/公告号KR101929952B1

    专利类型

  • 公开/公告日2018-12-18

    原文格式PDF

  • 申请/专利权人 JEONG CHAN BOUNG;

    申请/专利号KR1020180056051

  • 发明设计人 JEONG CHAN BOUNG;

    申请日2018-05-16

  • 分类号H05K3/46;H05K3;H05K3/06;H05K3/34;H05K3/42;

  • 国家 KR

  • 入库时间 2022-08-21 11:52:00

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