Large area VHF PECVD chamber for low-damage and high-throughput plasma processing

摘要

Embodiments disclosed herein generally relate to a plasma processing system for modifying a uniformity pattern of a thin film deposited in a plasma processing chamber including at least one VHF power generator coupled to a diffuser in a plasma processing chamber. The feed position offset of each VHF power generator and control of each VHF power generator through phase modulation and sweeping allows for plasma uniformity improvements by compensating for the non-uniformity of the thin film patterns caused by the chamber due to the standing wave effect. The power distribution between a plurality of VHF power generators coupled to the backing plate and / or disposed at different locations on the backing plate may be achieved by dynamic phase modulation between VHF power applied to different coupling points.