Stand-Alone Interface for Stacked Silicon Interconnect (SSI) Technology Integration

摘要

A programmable IC die (e.g., a super logic region (SLR)) of an existing suitable stacked silicon interconnect (SSI) technology without changing the programmable IC die (e.g., without adding or removing blocks) A method and apparatus for adding one or more features (e. G., High bandwidth memory (HBM) One exemplary integrated circuit (IC) package 200 generally includes a package substrate 202; At least one interposer (204) disposed on the package substrate (202) and including a plurality of interconnect lines (310, 312); A programmable IC die 302 disposed over the interposer 204; A stationary feature die 304 disposed over the interposer 204; And a first set of interconnect lines 310 and an interface die 306 disposed over interposer 204 and routed through interposer 204 between programmable IC die 302 and interface die 306. [ To couple the programmable IC die 302 to the fixed feature die 304 using a second set of interconnect lines 312 that are routed through the interposer 204 between the fixed feature die 304 and the fixed feature die 304 And an interface die 306 configured.