机译:使用具有堆叠式硅互连技术的28-nm FPGA实现可制造的3-D技术和生态系统
Xilinx Inc, 2100 Logic Drive, San Jose, California;
Xilinx Inc, 2100 Logic Drive, San Jose, California;
Xilinx Inc, 2100 Logic Drive, San Jose, California;
Xilinx Inc, 2100 Logic Drive, San Jose, California;
Xilinx Inc, 2100 Logic Drive, San Jose, California;
Siliconware Precision Industries Co Ltd, No. 153, Sec. 3, Chung-Shan Rd, Tantzu, Taichung 42756, Taiwan, China;
Siliconware Precision Industries Co Ltd, No. 153, Sec. 3, Chung-Shan Rd, Tantzu, Taichung 42756, Taiwan, China;
Siliconware Precision Industries Co Ltd, No. 153, Sec. 3, Chung-Shan Rd, Tantzu, Taichung 42756, Taiwan, China;
Siliconware Precision Industries Co Ltd, No. 153, Sec. 3, Chung-Shan Rd, Tantzu, Taichung 42756, Taiwan, China;
Siliconware Precision Industries Co Ltd, No. 153, Sec. 3, Chung-Shan Rd, Tantzu, Taichung 42756, Taiwan, China;
Interposer; stacked silicon interconnect technology; manufacturing yield; warpage; microjoining;
机译:Ilinx堆叠式硅互连技术可提供突破性的FPGA性能
机译:堆叠式硅互连技术产生了巨大的FPGA
机译:适用于高性能和低成本FPGA的新型堆叠式芯片互连技术
机译:使用具有堆栈硅互连技术的28nm FPGA实现可制造的3D技术和生态系统
机译:堆叠水平纳米线新兴三维IC技术的设计自动化与评价
机译:为决策提供支持的智能制造技术
机译:关于SK Hynix与SEMATECH制作的铜通硅通孔(TSV)样品的机械应力–实现鲁棒且可靠的3-D互连/集成电路(IC)技术