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POWDER COMPOSITION FOR FORMING THICK FILM CONDUCTOR AND PASTE FOR FORMING THICK FILM CONDUCTOR
POWDER COMPOSITION FOR FORMING THICK FILM CONDUCTOR AND PASTE FOR FORMING THICK FILM CONDUCTOR
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机译:用于形成厚膜导体的粉末组合物和用于形成厚膜导体的糊剂
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摘要
The present invention relates to a powder composition for forming a thick film conductor, which can form the thick film conductor which is easy to plate, and a paste for forming a thick film conductor. The powder composition for forming a thick film conductor comprises: conductive powder; lead-free glass powder; and manganese oxide powder, wherein the content of the glass powder is 1.5 to 5 parts by mass with respect to 100 parts by mass of the conductive powder, and the content of the manganese oxide powder is 0.5 to 3.5 parts by mass with respect to 100 parts by mass of the conductive powder.
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