首页> 外国专利> POWDER COMPOSITION FOR FORMING THICK FILM CONDUCTOR AND PASTE FOR FORMING THICK FILM CONDUCTOR

POWDER COMPOSITION FOR FORMING THICK FILM CONDUCTOR AND PASTE FOR FORMING THICK FILM CONDUCTOR

机译:用于形成厚膜导体的粉末组合物和用于形成厚膜导体的糊剂

摘要

The present invention relates to a powder composition for forming a thick film conductor, which can form the thick film conductor which is easy to plate, and a paste for forming a thick film conductor. The powder composition for forming a thick film conductor comprises: conductive powder; lead-free glass powder; and manganese oxide powder, wherein the content of the glass powder is 1.5 to 5 parts by mass with respect to 100 parts by mass of the conductive powder, and the content of the manganese oxide powder is 0.5 to 3.5 parts by mass with respect to 100 parts by mass of the conductive powder.
机译:本发明涉及用于形成厚膜导体的粉末组合物和用于形成厚膜导体的糊剂,所述粉末组合物可以形成易于镀覆的厚膜导体。用于形成厚膜导体的粉末组合物包括:导电粉末;和无铅玻璃粉;以及氧化锰粉末,其中相对于导电性粉末100质量份,玻璃粉末的含量为1.5〜5质量份,相对于导电性粉末100,氧化锰粉末的含量为0.5〜3.5质量份。导电粉的质量份。

著录项

  • 公开/公告号KR20190072424A

    专利类型

  • 公开/公告日2019-06-25

    原文格式PDF

  • 申请/专利权人 SUMITOMO METAL MINING CO. LTD.;

    申请/专利号KR20180157111

  • 发明设计人 AWAGAKUBO SHINGO;

    申请日2018-12-07

  • 分类号H01B1/22;C03C8/14;

  • 国家 KR

  • 入库时间 2022-08-21 11:50:35

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