COMPOSITION FOR FORMING THICK FILM CONDUCTOR, THICK FILM CONDUCTOR FORMED BY USING THE SAME, AND CHIP RESISTOR USING THICK FILM CONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide a lead-free composition for forming a thick film conductor which excels in both sulfide resistance and solder resistance at low cost.;SOLUTION: The present invention relates to a composition used for forming a thick film conductor which is used as an electrode of a chip resistor. The composition of the present invention contains Ag powder as conductive powder and SiO₂-B₂O₃-Al₂O₃-CaO-Li₂O-group glass powder and Al₂O₃ powder as oxide powder, and also has carbon powder added as additive. Per 100 pts.mass of conductive powder, there are included 1-10 pts.mass of the carbon powder, 0.1-15 pts.mass of the glass powder, and 0.1-8 pts.mass of the Al₂O₃ powder. The composition of the glass powder is SiO₂:20-60 mass%, B₂O₃:2-25 mass%, Al₂O₃:2-25 mass%, CaO:20-50 mass%, and Li₂O:0.5-6 mass%.;COPYRIGHT: (C)2012,JPO&INPIT