THICK-FILM CONDUCTOR FORMING COMPOSITE AND FORMING METHOD OF THICK-FILM CONDUCTOR USING SAME, AND THICK-FILM CONDUCTOR OBTAINED BY METHOD

摘要

PROBLEM TO BE SOLVED: To provide a thick-film conductor forming composite which prevents a sintering bonding between elements and does not impair element characteristics when forming a thick-film conductor for a terminal electrode on an electronic component, a forming method of a thick-film conductor using the above composite and a thick-film conductor obtained by the method.;SOLUTION: The thick-film conductor forming composite contains a conductive powder (A) composed of a conductive powder (a1) having a high conductivity and a conductive powder (a2) having a lower conductivity than the conductive powder (a1), an oxide powder (B) and an organic vehicle (C). The conductive powder (a2) has an average particle diameter 7μm or more and a content of the conductive powder (a2) is 4.0 to 8.0 wt.pt. against 100 wt.pt. of the conductive powder (a1).;COPYRIGHT: (C)2008,JPO&INPIT