METHOD FOR FORMING THICK-FILM CONDUCTOR WIRING

摘要

PROBLEM TO BE SOLVED: To solve such problems as short-circuiting, disconnection, and waving of the wires due to the dripping of thick-film conductor paste by forming a thick-film conductor wire using photosensitive resin. ;SOLUTION: A photosensitive resin layer 2 is formed on a ceramic substrate 1 by screen printing, UV is applied through a mask, and a groove part 3 is formed at a wiring part. A conductor paste 5 is subjected to screen printing at the obtained groove part 3. Then, remaining photosensitive resin is eliminated by baking, thus obtaining a fine and accurate thick-film conductor wire 7.;COPYRIGHT: (C)1997,JPO