Apparatus and Methods for Wafer Rotation to Improve Spatial ALD Process Uniformity

摘要

Methods and apparatus for rotating wafers during processing include a wafer rotation assembly having a support fixture coupled to a shaft, and a wafer transfer assembly having a robot blade, the robot blade having an opening through the robot blade, the opening Is sized to allow the support surface of the support fixture to pass through the opening. In order to rotate the support fixture assembly about the axis of the shaft, a first actuator is connected to the wafer rotation assembly. A second actuator is connected to the wafer rotation assembly to move the support fixture assembly by the stroke distance along the axis of the shaft. Process kits including wafer rotation assemblies and robotic blades with openings can be used to retrofit existing mainframe processing chambers.