Semiconductor device, chip-shaped semiconductor element, electronic device provided with semiconductor device, and manufacturing method of semiconductor device

摘要

The semiconductor device consists of a wiring board and a chip-shaped semiconductor element flip-chip mounted on the wiring board, and on the surface of the chip-shaped semiconductor element on the side opposite to the wiring board, a plurality of solder bumps and a plurality of insulating materials The projection is provided, and the chip-shaped semiconductor element is disposed so as to face the wiring board through the underfill material in a state where an underfill material having a property of decreasing viscosity with a temperature rise is applied on the wiring board, and then reflow processing is performed. By implementation, flip chip mounting is carried out on the wiring board.