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SEMICONDUCTOR DEVICE, CHIP-SHAPED SEMICONDUCTOR ELEMENT, ELECTRONIC DEVICE PROVIDED WITH SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE, CHIP-SHAPED SEMICONDUCTOR ELEMENT, ELECTRONIC DEVICE PROVIDED WITH SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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机译:半导体装置,芯片状的半导体元件,具有该半导体装置的电子装置以及制造该半导体装置的方法
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摘要
A semiconductor device includes a wiring board and a chip-shaped semiconductor element flip-chip mounted on the wiring board, in which a plurality of solder bumps and a plurality of protrusions including an insulating material are provided on a surface of the chip-shaped semiconductor element on a side facing the wiring board, and the chip-shaped semiconductor element is arranged so as to face the wiring board via an underfilling material in a state in which the underfilling material having a characteristic that viscosity decreases with an increase in temperature is applied to the wiring board and then subjected to reflow treatment to be flip-chip mounted on the wiring board.
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