LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

摘要

(a) 10% or less by weight of silver, (b) 10% by weight or less of bismuth, (c) up to 3% by weight of copper, (d) at least one of the following elements, 1% by weight or less of nickel, 1% by weight or less of titanium, 1% by weight or less of cobalt, Not more than 3.5% by weight of indium, 1% by weight or less of zinc, 1% by weight or less of arsenic, (e) optionally, one or more of the following elements, 0 to 1% by weight of manganese, 0 to 1% by weight of chromium, 0 to 1% by weight of germanium, 0 to 1% by weight of iron, 0 to 1% by weight aluminum, 0 to 1% by weight phosphorus, 0 to 1% by weight of gold, 0 to 1% by weight of gallium, 0 to 1% by weight of tellurium, 0 to 1% by weight of selenium, 0 to 1% by weight calcium, 0 to 1% by weight of vanadium, 0 to 1% by weight of molybdenum, 0 to 1% by weight of platinum, 0 to 1% by weight of magnesium, 0 to 1% by weight of a rare earth element, (f) A lead-free, antimony-free solder alloy containing the remainder of the tin, along with any unavoidable impurities.