STACKED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

摘要

Stack package and a manufacturing method thereof. The stack package includes a substrate, a first semiconductor chip mounted on the substrate, a first bonding member covering a part of the substrate including the first semiconductor chip, and a bump provided on one surface of the substrate, A second semiconductor chip mounted on the substrate under the first semiconductor chip and the first bonding member such that the bumps are bonded on the first bonding member and the other surface opposed to the first surface is polished flat; Chip.