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Thin Film Transistor and Manufacturing Method Thereof

机译:薄膜晶体管及其制造方法

摘要

The present invention relates to a thin film transistor and a method of manufacturing the same, wherein the thin film transistor 200 includes a gate electrode 21 formed on a substrate 20; A semiconductor layer 25 formed on the insulating layer 23 formed on the gate electrode 21; And a source electrode 27 and a drain electrode 29 formed on the semiconductor layer 25, wherein the source electrode 27 and the drain electrode 29 are positioned at both ends of the semiconductor layer 25. Connected to the semiconductor layer 25; The insulating layer 23 may include a first insulating layer 231 and a second insulating layer 232, and the second insulating layer 232 may include the first insulating layer 231 and the semiconductor layer 25. Is located between). In the above-described thin film transistor and its manufacturing method, an insulating layer having a double layer structure is used to improve interface characteristics and to repair interface state defects in a semiconductor layer, thereby improving performance of the thin film transistor.
机译:薄膜晶体管及其制造方法技术领域本发明涉及一种薄膜晶体管及其制造方法,其中,薄膜晶体管200包括形成在基板20上的栅电极21;以及形成在衬底20上的栅电极21。半导体层25形成在绝缘层23上,绝缘层23形成在栅电极21上;在半导体层25上形成有源电极27和漏电极29,其中,源电极27和漏电极29位于半导体层25的两端。绝缘层23可以包括第一绝缘层231和第二绝缘层232,并且第二绝缘层232可以包括第一绝缘层231和半导体层25。在上述薄膜晶体管及其制造方法中,具有双层结构的绝缘层用于改善界面特性并修复半导体层中的界面状态缺陷,从而改善薄膜晶体管的性能。

著录项

  • 公开/公告号KR102035847B1

    专利类型

  • 公开/公告日2019-10-23

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20187007422

  • 申请日2016-08-15

  • 分类号H01L29/786;H01L29/49;H01L29/51;

  • 国家 KR

  • 入库时间 2022-08-21 11:47:29

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