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Manufacturing Gallium Doped ZnO Thin Films Suitable for Use in Thin Film Transistors Using Unbalanced Magnetron Sputtering

机译:使用不平衡磁控溅射制造适用于薄膜晶体管的镓掺杂ZnO薄膜

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摘要

Gallium doped zinc oxide (GZO) thin films were deposited onto Si (100) substrates. Depositions were performed at relatively low temperatures suitable for use in manufacturing thin films on plastic substrates. Substrates were thermally oxidized, and then thin films were deposited via radio frequency (RF) unbalanced magnetron sputtering. ZnO thin films were also sputtered in order to act as a seed layer for growing nanostructures by the hydrothermal method. Sputtering parameters evaluated independently include pressure, gas composition, power, temperature and the presence of an external magnetic field. Scanning electron microscopy (SEM) was performed on hydrothermally produced samples. Sputtered films used to compare sputtering parameters were grown at thicknesses of 33-64 nm as measured by ellipsometry. The GZO sputtering target had a 5% gallium content, which was deposited on the thin films. This was confirmed by X-ray Photoelectron Spectroscopy (XPS). Films were also evaluated using Raman spectroscopy and four-point probe terminal sensing. Using a comparison of the X-ray diffraction (XRD) of the films, it was possible to evaluate the sputtering parameters in order to minimize their crystallite size. It was calculated that the optimum power to apply to the target in order to minimize crystallite size was 128W. Films also minimized crystallite size by several other independent factors, such as not being in the presence of oxygen, being in the presence of an external magnetic field, being at a higher temperature, or being at a higher pressure during sputtering.
机译:将掺杂镓的氧化锌(GZO)薄膜沉积到Si(100)衬底上。在适合用于在塑料基板上制造薄膜的相对较低的温度下进行沉积。将衬底热氧化,然后通过射频(RF)不平衡磁控溅射沉积薄膜。 ZnO薄膜也被溅射,以用作通过水热法生长纳米结构的种子层。独立评估的溅射参数包括压力,气体成分,功率,温度和外部磁场的存在。对水热产生的样品进行扫描电子显微镜(SEM)。通过椭圆光度法测量,用于比较溅射参数的溅射膜以33-64nm的厚度生长。 GZO溅射靶的镓含量为5%,沉积在薄膜上。 X射线光电子能谱法(XPS)证实了这一点。还使用拉曼光谱和四点探针终端感测对膜进行评估。通过对薄膜的X射线衍射(XRD)进行比较,可以评估溅射参数,以最小化其微晶尺寸。据计算,为最小化微晶尺寸而施加至靶材的最佳功率为128W。膜还通过其他几个独立的因素来最小化微晶尺寸,例如不存在氧气,存在外部磁场,处于较高温度或在溅射过程中处于较高压力。

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    Jones Timothy Russell;

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  • 年度 2013
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