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Electronic power module with elastic contacts and stack construction with such a power module

机译:具有弹性触点的电子功率模块以及具有这种功率模块的堆叠结构

摘要

An electronic power module comprising a substrate plate (12) carrying on a mounting side (14) a power electronic circuit comprising components (15a, 15b) contacted with elastic contacts, said elastic contacts consisting of monolithic structures (19) of a composite material, which contains an electrically conductive component (20, 30, 35, 37) and a further component (21, 31, 34, 38, 39), wherein the composite material has a lower elastic modulus E than the electrically conductive component, wherein the monolithic structures (19) directly on the components (15a, 15b), wherein the substrate plate (12) has an outer frame (23) on which also monolithic structures (19) put on, and wherein fixed on the monolithic structures, a leadframe (22) is.
机译:一种电子功率模块,其包括在安装侧(14)上承载功率电子电路的基板(12),该功率电子电路包括与弹性触点接触的组件(15a,15b),所述弹性触点由复合材料的整体式结构(19)组成,其包含导电组分(20、30、35、37)和其他组分(21、31、34、38、39),其中复合材料的弹性模量E比导电组分低,其中整体材料元件(15a,15b)上的结构(19),其中基板(12)具有外部框架(23),在该外部框架上也放置有整体结构(19),并且其中固定有引线框架(19)在该整体结构上22)是。

著录项

  • 公开/公告号DE102013219433B4

    专利类型

  • 公开/公告日2019-05-29

    原文格式PDF

  • 申请/专利权人 SIEMENS AKTIENGESELLSCHAFT;

    申请/专利号DE201310219433

  • 申请日2013-09-26

  • 分类号H01L23/488;H01L23/492;H01L23/46;H01L25/10;B22F3/11;

  • 国家 DE

  • 入库时间 2022-08-21 11:45:47

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