A method for making a high chrome cast iron cast cermet TiC chip and a method for manufacturing a plate liner for a bellless raw material charging device using this method.

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a cast iron cast gurney structure for realizing brazing joining of a cermet TiC chip and high chromium cast iron without removing a vacuum coating thin film. SOLUTION: A cermet TiC chip whose surface is coated with a vacuum thin film is electroless copper plated or electroless Ni plated, and then electrically Ni-B plated, and a liquid flux containing a clay particle is dipped and adhered and heated. In the method of forming a fired film of flux and casting the cermet TiC chip with high-chromium cast iron, the porcelain clay-containing liquid flux comprises boric acid, borax 7 to 10 wt%, and potassium fluoride 5 to 10 wt%. Cermet TiC characterized by containing 5 to 10 wt% of potassium borofluoride, 38 to 20 wt% of potassium feldspar, sodium feldspar and kaolinite, and setting the melting point of the fired film to 1200°C ± 50°C. High chrome cast iron casting method for chips. And the plate liner structure adopting this casting method. [Selection diagram] Fig. 14