A high-chromium cast iron cast-in method for cermet TiC chips and a plate liner manufacturing method for a bellless raw material charging apparatus using this method.

摘要

The present invention provides a cast iron cast structure manufacturing method that realizes brazed joining of a cermet TIC chip and high chromium cast iron without removing a vacuum coating thin film. A cermet TIC chip whose surface is coated with a vacuum thin film is subjected to electroless copper plating or electroless Ni plating, followed by electric Ni-B plating, dipping and attaching a liquid flux containing porcelain particles, and heating. In the method of forming a fired film of the flux and casting the cermet TIC chip with high chromium cast iron, the porcelain granule-containing liquid flux comprises boric acid, borax 7 to 10 wt%, potassium fluoride 5 to 10 wt% Cermet TiC characterized in that 5-10 wt% of potassium borofluoride and 38-20 wt% of the ratio of potassium feldspar, sodium feldspar, and kaolinite were contained, and the melting point of the fired film was 1200 ° C. ± 50 ° C. High chrome cast iron filling method for chips. And a plate liner structure using this cast-in method. [Selection] Figure 14