Positive photosensitive resin composition, method for producing patterned cured film, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component

摘要

A positive photosensitive resin composition which contains (a) an alkali-soluble resin, (b) an onium salt which generates an acid by means of i-beam exposure, (c) a solvent and (d) a crosslinking agent, and wherein the total mass of the components (a), (b) and (d) relative to the total mass of the positive photosensitive resin composition excluding (c) the solvent is 88% by mass or more.