Conductive pattern, substrate with conductive pattern, method for manufacturing substrate with conductive pattern, structure having conductive pattern on surface, and method for manufacturing the structure

摘要

The purpose of the present invention is to provide: an electroconductive pattern capable of reducing the visibility of electroconductive wiring, reducing the resistance value, improving adhesiveness between a substrate and an electroconductive pattern, minimizing fluctuation in resistance values when the substrate is bent, and furthermore imparting durability such as heat and moisture resistance; a substrate with an electroconductive pattern; a method for manufacturing a substrate with an electroconductive pattern; a structure having an on-surface electroconductive pattern; and a method for manufacturing said structure. A pattern comprising an electroconductive fine wire (2) measuring less than 10 μm in width, characterized in that at least a portion of the fine wire has a multilayered structure, and the multilayered structure has as constituent elements: a first layer (21) measuring less than 500 nm in thickness and containing one or more electroconductive materials selected from electroconductive particles, an electroconductive filler, and an electroconductive wire; and a second layer (22) that is thicker than the first layer (21) and has metal as a principal component.