Warp straightener for fan-out type wafer level package

摘要

To provide a warp correction material for FO-WLP capable of reducing warpage of a wafer or a package by adjusting an amount of warpage even at a time of mounting a fan-out type wafer level package (FO-WLP) even at room temperature such as wafer transfer. A volume shrinks due to irradiation with active energy rays. Further the volume shrinks due to heating after irradiation with the active energy ray. Thereby, a fan-out type wafer level package warp correction material is formed.