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Board assembly apparatus, board assembly system using the apparatus, and board assembly method using the system

机译:板组装设备,使用该设备的板组装系统以及使用该系统的板组装方法

摘要

PROBLEM TO BE SOLVED: To provide a substrate assembling device efficiently removing gas from a space between an upper substrate and a lower substrate, a substrate assembling system using the device and a substrate assembling method using the system.SOLUTION: The substrate assembling device comprises a vacuum chamber 5 which can store an upper substrate K1 and a lower substrate K2 under a vacuum environment, a vertically moving mechanism (a Z-axis driving mechanism 20) which moves the upper substrate vertically and a vacuum pump mechanism P0 which performs vacuuming for exhausting gas inside the vacuum chamber 5 to the outside. The vertically moving mechanism (the Z-axis driving mechanism 20) changes a separation distance between the upper substrate K1 and the lower substrate K2 by moving the upper substrate K1 in a vertical direction during performing the vacuuming.SELECTED DRAWING: Figure 8I
机译:解决的问题:为了提供一种基板组装装置,该装置能够有效地去除上基板和下基板之间的空间中的气体,使用该装置的基板组装系统和使用该系统的基板组装方法。能够在真空环境下存储上基板K1和下基板K2的真空室5,使上基板垂直移动的上下移动机构(Z轴驱动机构20)和进行抽真空的真空泵机构P0真空室5内的气体向外部排出。垂直移动机构(Z轴驱动机构20)通过在进行抽真空期间沿竖直方向移动上基板K1来改变上基板K1和下基板K2之间的分离距离。选图,图8I

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