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Substrate processing apparatus, method for detaching substrate from vacuum suction table of substrate processing apparatus, and method for mounting substrate on vacuum suction table of substrate processing apparatus
Substrate processing apparatus, method for detaching substrate from vacuum suction table of substrate processing apparatus, and method for mounting substrate on vacuum suction table of substrate processing apparatus
One embodiment of the present invention provides a substrate processing apparatus having a vacuum suction table adapted to have a substrate placed thereon, and a plurality of lift pins disposed along the outer periphery of the vacuum suction table. The lift pins each have a distal end portion including a substrate guide surface capable of guiding the outer peripheral end surface of the substrate, and a proximal end portion including a substrate holding surface extending from the substrate guide surface outwardly in a radial direction of the lift pin. The lift pins are stoppable in a lower end position where the substrate guide surface of each of the lift pins is disposed below a suction-holding surface of the vacuum suction table, an upper end position where the substrate holding surface of each of the lift pins is disposed above the suction-holding surface of the vacuum suction table, and an intermediate position between the lower end position and the upper end position. In the intermediate position, the substrate guide surface of each of the lift pins is disposed above the suction-holding surface of the vacuum suction table, and the substrate holding surface of each of the lift pins is disposed below the suction-holding surface of the vacuum suction table.
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