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Multi-layer cooling structure including through-silicon vias through a plurality of directly-bonded substrates and methods of making the same
Multi-layer cooling structure including through-silicon vias through a plurality of directly-bonded substrates and methods of making the same
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机译:包括穿过多个直接键合衬底的硅通孔的多层冷却结构及其制造方法
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摘要
A multi-layer cooling structure comprising a first substrate layer comprising an array of cooling channels, a second substrate layer comprising a nozzle structure that includes one or more nozzles, an outlet, and an outlet manifold, a third substrate layer comprising an inlet manifold and an inlet, and one or more TSVs disposed through the first substrate layer, second substrate layer, and third substrate layer. At least one of the one or more TSVs is metallized. The first substrate layer and the second substrate layer are directly bonded, and the second substrate layer and the third substrate layer are directly bonded.
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