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Semiconductor film composition, method of manufacturing semiconductor film composition, method of manufacturing semiconductor member, method of manufacturing semiconductor processing material, and semiconductor device

机译:半导体膜组成物,半导体膜组成物的制造方法,半导体构件的制造方法,半导体处理材料的制造方法以及半导体装置

摘要

A composition for forming a film for semiconductor devices including: a compound (A) including a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and having a weight average molecular weight of from 10,000 to 400,000; a crosslinking agent (B) which includes the three or more —C(═O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(═O)OX groups are —C(═O)OH groups, and which has a weight average molecular weight of from 200 to 600; and water (D), in which the compound (A) is an aliphatic amine.
机译:用于形成半导体器件的膜的组合物,包括:化合物(A),其包含阳离子官能团,所述阳离子官能团包含伯氮原子或仲氮原子中的至少一个,并且重均分子量为10,000至400,000;和在分子中包含三个以上的-C(= O)OX基(X为氢原子或碳原子数为1至6的烷基)的交联剂(B),其中三个中的一个至六个-C(= O)OX基为-C(= O)OH基,重均分子量为200〜600。水(D),其中化合物(A)为脂肪族胺。

著录项

  • 公开/公告号US10759964B2

    专利类型

  • 公开/公告日2020-09-01

    原文格式PDF

  • 申请/专利权人 MITSUI CHEMICALS INC.;

    申请/专利号US201615776013

  • 申请日2016-11-16

  • 分类号C09D177/06;C08G73/02;C08G73/10;H01L21/02;H01L21/3105;C08G69/42;H01L23/29;C08K5/092;C08K3/28;C08K5/09;

  • 国家 US

  • 入库时间 2022-08-21 11:29:49

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