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Method of manufacturing semiconductor device including implanting impurities into an implanted region of a semiconductor layer and annealing the implanted region

机译:制造半导体器件的方法,包括将杂质注入到半导体层的注入区中并对该注入区进行退火

摘要

A technique that recovers from degradation in crystalline nature in an ion-implanted region is provided. A method of manufacturing a semiconductor device, includes: an ion implantation step of ion-implanting p-type impurities by a cumulative dose D into an n-type semiconductor layer containing n-type impurities; and a thermal annealing step of annealing an ion-implanted region of the n-type semiconductor layer where the p-type impurities are ion-implanted, in an atmosphere containing nitrogen, at a temperature T for a time t, wherein the cumulative dose D, the temperature T, and the time t satisfy a predetermined relationship.
机译:提供了一种从离子注入区域中的晶体性质的退化中恢复的技术。一种半导体器件的制造方法,包括:离子注入步骤,以累积剂量D离子注入p型杂质到含有n型杂质的n型半导体层中;以及在包含氮的气氛中,在温度T下,在时间t处对n型半导体层的离子注入p型杂质的离子注入区域进行退火的时间t,其中,累积剂量D ,温度T和时间t满足预定关系。

著录项

  • 公开/公告号US10636663B2

    专利类型

  • 公开/公告日2020-04-28

    原文格式PDF

  • 申请/专利权人 TOYODA GOSEI CO. LTD.;

    申请/专利号US201815914046

  • 申请日2018-03-07

  • 分类号H01L21/265;H01L21/266;H01L21/324;H01L21/02;H01L29/20;H01L29/207;H01L29/872;H01L29/78;H01L29/66;H01L29/861;H01L29/06;H01L29/778;H01L29/423;

  • 国家 US

  • 入库时间 2022-08-21 11:28:06

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