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Method for forming a micro-electro mechanical system (MEMS) including bonding a MEMS substrate to a CMOS substrate via a blocking layer
Method for forming a micro-electro mechanical system (MEMS) including bonding a MEMS substrate to a CMOS substrate via a blocking layer
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机译:形成微机电系统(MEMS)的方法,该方法包括经由阻挡层将MEMS基板粘合到CMOS基板
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摘要
A method for forming a micro-electro mechanical system (MEMS) device is provided. The method includes forming a first dielectric layer over a semiconductor layer and forming a blocking layer over the first dielectric layer. The method also includes bonding a CMOS substrate with the blocking layer, and the CMOS substrate includes a second dielectric layer, and the blocking layer is configured to block gas coming from the second dielectric layer. The method further includes partially removing the first dielectric layer to form a cavity between the semiconductor layer and the blocking layer. A portion of the semiconductor layer above the cavity becomes a movable element. In addition, the method includes sealing the cavity such that a closed chamber is formed to surround the movable element.
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