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Micro-electro mechanical system (MEMS) device having a blocking layer formed between closed chamber and a dielectric layer of a CMOS substrate

机译:具有在封闭腔室和CMOS基板的介电层之间形成的阻挡层的微机电系统(MEMS)装置

摘要

Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a CMOS substrate and a MEMS substrate bonded with the CMOS substrate. The CMOS substrate includes a semiconductor substrate, a first dielectric layer formed over the semiconductor substrate, and a plurality of conductive pads formed in the first dielectric layer. The MEMS substrate includes a semiconductor layer having a movable element and a second dielectric layer formed between the semiconductor layer and the CMOS substrate. The MEMS substrate also includes a closed chamber surrounding the movable element. The MEMS substrate further includes a blocking layer formed between the closed chamber and the first dielectric layer of the CMOS substrate. The blocking layer is configured to block gas, coming from the first dielectric layer, from entering the closed chamber.
机译:提供了用于形成微机电系统(MEMS)装置的机构的实施例。 MEMS器件包括CMOS衬底和与CMOS衬底接合的MEMS衬底。 CMOS衬底包括:半导体衬底;形成在半导体衬底上方的第一介电层;以及形成在第一介电层中的多个导电焊盘。 MEMS基板包括具有可移动元件的半导体层和形成在半导体层与CMOS基板之间的第二介电层。 MEMS衬底还包括围绕可移动元件的封闭室。 MEMS基板还包括形成在密闭室和CMOS基板的第一介电层之间的阻挡层。阻挡层被配置为阻挡来自第一介电层的气体进入封闭室。

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