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Optoelectronic lighting device, carrier for an optoelectronic semiconductor chip, and optoelectronic lighting system

机译:光电照明装置,光电半导体芯片的载体以及光电照明系统

摘要

An optoelectronic lighting device includes an optoelectronic semiconductor chip including a top side and an underside opposite the top side, wherein a semiconductor layer sequence is formed between the top side and the underside, the semiconductor layer sequence includes an active zone that generates electromagnetic radiation, and a barrier for a bonding material flowing on account of cohesive bonding of the semiconductor chip to a carrier is formed at one of the top side and the underside.
机译:一种光电照明装置,包括光电半导体芯片,该光电半导体芯片包括顶侧和与顶侧相对的底侧,其中在顶侧和底侧之间形成半导体层序列,该半导体层序列包括产生电磁辐射的有源区,以及在顶侧和底侧之一上形成用于由于半导体芯片与载体的粘结而流动的结合材料的阻挡层。

著录项

  • 公开/公告号US10833475B2

    专利类型

  • 公开/公告日2020-11-10

    原文格式PDF

  • 申请/专利权人 OSRAM OLED GMBH;

    申请/专利号US201716081881

  • 发明设计人 CHRISTOPH EICHLER;SVEN GERHARD;

    申请日2017-03-03

  • 分类号H01S5/022;H01L33/48;H01L33/20;H01L33/44;H01L33/62;H01L33/64;H01S5/024;H01S5/028;H01S5/10;H01S5/22;H01S5/40;

  • 国家 US

  • 入库时间 2022-08-21 11:27:18

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