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GROUP III-V COMPOUND SEMICONDUCTOR SUBSTRATE AND GROUP III-V COMPOUND SEMICONDUCTOR SUBSTRATE WITH EPITAXIAL LAYER
GROUP III-V COMPOUND SEMICONDUCTOR SUBSTRATE AND GROUP III-V COMPOUND SEMICONDUCTOR SUBSTRATE WITH EPITAXIAL LAYER
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机译:具有外延层的III-V组复合半导体基质和III-V组复合半导体基质
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摘要
An InP substrate that is a group III-V compound semiconductor substrate includes particles of greater than or equal to 0.19 μm in particle size at less than or equal to 0.22 particles/cm2 or particles of greater than or equal to 0.079 μm in particle size at less than or equal to 20 particles/cm2 on the main surface. An epilayer-attached InP substrate that is an epilayer-attached group III-V compound semiconductor substrate includes the InP substrate mentioned above and an epitaxial layer disposed on the main surface of the InP substrate, and includes LPDs of greater than or equal to 0.24 μm in circle-equivalent diameter at less than or equal to 10 defects/cm2 or LPDs of greater than or equal to 0.136 μm in circle-equivalent diameter at less than or equal to 30 defects/cm2 on the main surface in a case where the epitaxial layer has a thickness of 0.3 μm.
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机译:作为III-V族化合物半导体衬底的InP衬底包括具有大于或等于0.19μm的粒径的颗粒,其小于或等于0.22个颗粒/ cm 2 Sup>或大于或等于0.12μm的颗粒。主表面上小于或等于20个粒子/ cm 2 Sup>时,等于0.079μm。作为附有外延层的III-V族化合物半导体衬底的附有外延层的InP衬底包括上述的InP衬底和设置在InP衬底的主表面上的外延层,并且包括大于或等于0.24μm的LPD。圆当量直径小于或等于10个缺陷/ cm 2 Sup>或LPD大于或等于0.136μm的圆当量直径小于或等于30个缺陷/ cm 2 Sup>。
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