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III-V compound semiconductor substrate and III-V compound semiconductor substrate with epitaxial layer
III-V compound semiconductor substrate and III-V compound semiconductor substrate with epitaxial layer
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机译:具有外延层的III-V族化合物半导体衬底和III-V族化合物半导体衬底
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摘要
The InP substrate, which is a group III-V compound semiconductor substrate, has 0.22 particles / cm 2 or less of particles having a particle size of 0.19 μm or more on the main surface or 20 particles / cm of particles having a particle size of 0.079 μm or more. Including 2 or less. An InP substrate with an epi layer, which is an III-V group compound semiconductor substrate with an epi layer, includes the InP substrate and an epitaxial layer disposed on the main surface of the InP substrate, and has an epitaxial layer thickness of 0.3 μm. equal area circle diameter on the main surface of the above-LPD 0.24 .mu.m is 10 / cm 2 or less or equal area circle diameter containing 30 pieces / cm 2 or less or more LPD 0.136Myuemu when. Thereby, the III-V group compound semiconductor substrate and the III-V group compound semiconductor substrate with an epi layer which can reduce the defect of the epitaxial layer grown on the main surface are provided.
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机译:作为III-V族化合物半导体衬底的InP衬底的主表面上具有0.22个颗粒/ cm 2 Sup>或更少的颗粒,或者主表面上具有0.19μm或更大的颗粒尺寸。颗粒尺寸为0.079μm以上的颗粒。包括 2 Sup>或更少。具有外延层的InP衬底是具有外延层的III-V族化合物半导体衬底,其包括InP衬底和设置在InP衬底的主表面上的外延层,并且外延层厚度为0.3μm。 。上述LPD0.24μm的主表面上的等面积圆直径等于或小于10 / cm 2 Sup>或等于30个/ cm 2 Sup>的等面积圆直径LPD小于或等于0.136时。从而,提供了III-V族化合物半导体衬底和具有可减少在主表面上生长的外延层的缺陷的具有外延层的III-V族化合物半导体衬底。
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