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METHOD FOR PRODUCING CIRCUIT BOARD AND CIRCUIT BOARD PRODUCING APPARATUS, AND METHOD FOR PRODUCING INTEGRATED CIRCUIT USING THE SAME
METHOD FOR PRODUCING CIRCUIT BOARD AND CIRCUIT BOARD PRODUCING APPARATUS, AND METHOD FOR PRODUCING INTEGRATED CIRCUIT USING THE SAME
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机译：电路板和电路板制造装置的制造方法，以及使用该电路板和电路板制造装置的综合电路的制造方法
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摘要
A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.
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