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CERAMIC SUBSTRATE, COMPOSITE SUBSTRATE, CIRCUIT BOARD, METHOD FOR PRODUCING CERAMIC SUBSTRATE, METHOD FOR PRODUCING COMPOSITE SUBSTRATE, METHOD FOR PRODUCING CIRCUIT BOARD, AND METHOD FOR PRODUCING PLURALITY OF CIRCUIT BOARDS
CERAMIC SUBSTRATE, COMPOSITE SUBSTRATE, CIRCUIT BOARD, METHOD FOR PRODUCING CERAMIC SUBSTRATE, METHOD FOR PRODUCING COMPOSITE SUBSTRATE, METHOD FOR PRODUCING CIRCUIT BOARD, AND METHOD FOR PRODUCING PLURALITY OF CIRCUIT BOARDS
A ceramic substrate according to the present invention has a rectangular shape when viewed in plan. If the intersection of a pair of diagonal lines of the ceramic substrate is taken as a standard in the plate thickness direction of the ceramic substrate, either a pair of first regions or a pair of second regions, said regions respectively facing each other across the intersection, among four regions which are divided by the pair of diagonal lines is positioned on one side of the intersection in the plate thickness direction, while the other pair is positioned on the other side of the intersection in the plate thickness direction; and the value obtained by dividing the maximum projection amount of the ceramic substrate in the plate thickness direction by the length of the diagonal lines of the ceramic substrate is 6 μm/mm or less.
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