The purpose of the present invention is to provide an electrolytic Sn or Sn alloy plating solution capable of lowering Pb concentration. An electrolytic Sn or Sn alloy plating solution for forming a plated article for solder bonding, at least comprising: a sulfur-based compound; an Sn sa one or more types of acids or water-soluble salts thereof selected from inorganic acid, organic acid or water-soluble salt thereof; and a surfactant, wherein the sulfur-based compound is a thiol compound represented by following general formula (Formula. A), a salt of the thiol compound (Formula A), or a disulfide compound (Formula B).
展开▼
