The present invention relates to a dual pinch-type BGA socket device used for a test of a semiconductor element, the BGA socket device comprising: a contact (100) which includes a fixed side terminal (110) and a movable side terminal (120) provided in a pair while facing each other, wherein upper tip parts (111 and 122) of the fixed side terminal (110) and the movable side terminal (120) are provided to be offset (d) from each other by a predetermined interval with reference to a ball terminal (2) therebetween; a main body part (210) at which the contact (100) is vertically and fixedly provided; a cover (230) which is provided over the main body part (210) and is elastically supported, so that the cover (230) is longitudinally movable within a predetermined range of height from the main body part (210); and a slider (240) which is provided between the main body part (210) and the cover (230), is laterally slid in connection with the longitudinal position of the cover (230) to open or close the movable side terminal (120) in the horizontal direction, and includes a fixed side terminal receiving hole (245) having the fixed side terminal (110) formed therethrough and a movable side terminal receiving hole (246) having the movable side terminal (120) formed therethrough, wherein the fixed side terminal receiving hole (245) and the movable side terminal receiving hole (246) are offset (d) from each other as much as an offset (d) between the upper tip parts (111 and 122) of the contact, and the fixed side terminal receiving hole has a length longer than that of the movable side terminal receiving hole.
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