首页> 外国专利> HYDROCARBON THIN FILM, METHOD OF PREPARING HYDROCARBON THIN FILM, AND SEMICONDUCTOR DEVICE COMPRISING HYDROCARBON THIN FILM

HYDROCARBON THIN FILM, METHOD OF PREPARING HYDROCARBON THIN FILM, AND SEMICONDUCTOR DEVICE COMPRISING HYDROCARBON THIN FILM

机译:碳氢化合物薄膜,制备碳氢化合物薄膜的方法以及包括碳氢化合物薄膜的半导体装置

摘要

The present invention relates to a hydrocarbon thin film, a method of preparing same, and a semiconductor device using same, wherein the hydrocarbon thin film shows desirable uniformity as a thin film while having a significantly higher dielectric constant than that of a SiO2 thin film or a Hf- or Zr-based oxide thin film; and has an extremely low leakage current and a high dielectric strength, and thus can be applied to a semiconductor device of 10 nm node or less and achieve a desirable performance. In particular, the hydrocarbon thin film has an amorphous structure; and has a dielectric constant of 10 or more, wherein a ratio of relative intensities between hydrogen and carbon as measured by secondary-ion mass spectrometry (SIMS) is in the range of 4 to 30, and on C 1s spectra of X-ray photoelectron spectroscopy (XPS), a binding energy peak present between 280 eV to 290 eV has a binding energy (eV) shift of 0.5 eV or less between before and after a surface treatment using 1 keV argon (Ar+) plasma etching under any one of time conditions in the range of 5 seconds to 20 seconds.
机译:烃薄膜,其制备方法以及使用该烃薄膜的半导体器件技术领域本发明涉及一种烃薄膜,其制备方法以及使用该烃薄膜的半导体器件,其中该烃薄膜作为薄膜显示出期望的均匀性,同时具有比SiO 高的介电常数。 2 薄膜或基于Hf或Zr的氧化物薄膜;并且具有极低的泄漏电流和高介电强度,因此可以应用于10nm节点以下的半导体器件,并获得期望的性能。特别地,碳氢化合物薄膜具有无定形结构。并且具有10或更大的介电常数,其中通过二次离子质谱(SIMS)测量的氢和碳之间的相对强度比在4至30的范围内,并且在X射线光电子的C 1s光谱上光谱学(XPS),在280 eV至290 eV之间存在的结合能峰在任何时间使用1 keV氩(Ar +)等离子刻蚀进行表面处理之前和之后的结合能(eV)偏移为0.5 eV或更小条件在5秒到20秒之间。

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