LOW-INSERTION LOSS, HIGH-FREQUENCY AND HIGH-THERMAL CONDUCTIVE SUBSTRATE AND APPLICATION THEREOF

摘要

The present invention provides a low-insertion loss, high-frequency and high-thermal conductive substrate and application thereof. The thermal conductive substrate comprises the following layers: a first low profile copper foil layer, a thin film resistive layer, a first resin layer, a first thermal conductive bonding sheet or thermal conductive adhesive film layer, a third thermal conductive bonding sheet layer, a second thermal conductive bonding sheet or thermal conductive adhesive film layer, a second resin layer, and a second low profile copper foil layer which are sequentially combined together from top to bottom. The thermal conductive substrate has higher heat conductivity and peel strength, lower dielectric constant and dielectric loss, lower insertion loss and higher integration level, and the reliability of the thermal conductive substrate is improved; and the low-insertion loss, high-frequency and high-thermal conductive substrate can be used as a circuit board to be applied to electronic products.