CHIP INTERCONNECTION DEVICE, SUBSTRATE OF INTEGRATED BRIDGE STRUCTURE, AND MANUFACTURING METHOD THEREFOR

摘要

Some embodiments of the present application provide a chip interconnection device and a manufacturing method therefor. The chip interconnection device comprises: a first chip 102, a second chip 103, a substrate 101 and a bridge structure, wherein the bridge structure comprises an insulating body 104, a conductive member 111 located in the insulating body, and a first welding spot 109 and a second welding spot 110 located at a surface of the insulating body; a first end of the conductive member 111 is connected to the first welding spot 109, and a second end is connected to the second welding spot 110; the first chip 102 is connected to the first welding spot 109, and the second chip 103 is connected to the second welding spot 110; and the first chip and the second chip are both connected to the substrate, so that a process flow is simpler while electrical interconnection between the chips is realized, and assembly difficulty is reduced.