In the transition from a low-volume, prototyping environment to a high-volume manufacturing environment we have to rethink our existing "Flip Chip in Package" assembly solutions and there potential to meet future requirements for this market segment. The drivers clearly shift for high-volume assembly solutions. Throughput, investment cost, floorspace, yield and utilization have to be considered. Optimizing these factors means lower Cost of Ownership for the customer. As packaging cost of flip chip devices has to be lower every process step has to be optimized with respect to cost-efficiency. But the proposed integrated solution offers much more than just cost savings. Integrating all processes to electrically complete a flip chip device is another advantage. Higher integration leads to minimized handling and lower operator and maintenance requirements since one system executes the functions of three systems before.
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