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Method for Preparing Oxide Thin Transistor and Oxide Thin Transistor Prepared by Using the Same

机译:氧化物薄膜晶体管的制备方法及使用该方法制备的氧化物薄膜晶体管

摘要

The present invention, Forming a gate insulating film on the substrate on which the gate electrode is formed; Performing a plasma treatment process on the gate insulating film; Forming an oxide semiconductor thin film by applying an oxide semiconductor solution on the gate insulating film; Forming a source electrode and a drain electrode electrically connected to the oxide semiconductor thin film; An oxide thin film transistor manufacturing method and an oxide thin film transistor manufactured by the manufacturing method may include not only having excellent flatness and reliability, but also large-scale production of wafer units, and an oxide thin film transistor having excellent reproducibility through a batch process. to provide.
机译:本发明,在形成有栅电极的基板上形成栅绝缘膜。在栅极绝缘膜上进行等离子体处理;通过在栅极绝缘膜上施加氧化物半导体溶液来形成氧化物半导体薄膜;形成电连接至氧化物半导体薄膜的源电极和漏电极;氧化物薄膜晶体管的制造方法以及由该氧化物薄膜晶体管制造的氧化物薄膜晶体管不仅可以具有优异的平坦性和可靠性,而且还可以大规模生产晶片单元,并且通过批量生产而具有优异的再现性的氧化物薄膜晶体管。处理。提供。

著录项

  • 公开/公告号KR102045027B1

    专利类型

  • 公开/公告日2019-11-21

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20170180694

  • 发明设计人 박재순;전영진;전동환;

    申请日2017-12-27

  • 分类号H01L29/66;H01L21/02;H01L29/786;

  • 国家 KR

  • 入库时间 2022-08-21 11:08:31

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