Polyurethane polishing layer, polishing pad including polishing layer, manufacturing method of abrasive layer and material planarization method

摘要

The present invention provides a polishing pad, a polyurethane polishing layer, and a method for manufacturing the same, belonging to the polishing art of chemical mechanical planarization treatment. The polyurethane polishing layer having a coefficient of thermal expansion of 100 to 200 ppm / ° C contains the reaction product produced by the multicomponent reaction. Multicomponents include isocyanate terminated prepolymers, hollow microsphere polymers and curing agent compositions. The curing agent composition comprises 5 to 55 wt% of an aliphatic diamine composition, 0 to 8 wt% of a polyamine composition and 40 to 90 wt% of an aromatic bifunctional composition. The density of the polyurethane polishing layer is 0.6 to 1.1 g / cm ³ , the shore hardness is 45 to 70 D, and the elongation at break is 50 to 450%. The manufacturing process of the polyurethane polishing layer is simple, low cost, and low energy consumption. The polyurethane polishing layer produced by the above process has high hydrolysis stability, uniform density, and stable removal rate.