Resin composition, semiconductor encapsulant, one-component adhesive and adhesive film

摘要

Improved storage stability in resin compositions used for applications such as semiconductor encapsulants. The resin composition is a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) a silica filler, wherein the silica filler of the component (C) is a basic substance having an acid dissociation constant (pKa) of a conjugate acid of 9.4 or more. It is surface treated. Further, the resin composition contains (D) a silane coupling agent, or the silica filler of the component (C) is further treated with a silane coupling agent.