SUBSTRATE FOR POWER MODULES SUBSTRATE WITH HEAT SINK FOR POWER MODULES POWER MODULE METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULES AND PASTE FOR BONDING COPPER MEMBER

摘要

The substrate for power module is formed by laminating a copper plate made of copper or a copper alloy on the surface of the ceramic substrate 11, and between the copper plate and the ceramic substrate 11 on the surface of the ceramic substrate 11. The nitride layer 31 is formed, and the Ag-Cu eutectic structure layer 32 whose thickness is 15 micrometers or less is formed between the said nitride layer and the said copper plate.