SUBSTRATE FOR POWER MODULES SUBSTRATE WITH HEAT SINK FOR POWER MODULES POWER MODULE METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULES PASTE FOR COPPER PLATE BONDING AND METHOD FOR PRODUCING BONDED BODY

摘要

A power module substrate according to the present invention is a power module substrate in which a copper plate made of copper or a copper alloy is laminated on a surface of a ceramic substrate 11 and bonded thereto. Between the copper plate and the ceramic substrate 11, a ceramic substrate ( 11) The oxide layer 31 is formed on the surface, and the thickness of the Ag-Cu eutectic structure layer 32 is 15 µm or less.