SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULES, PASTE FOR COPPER PLATE BONDING, AND METHOD FOR PRODUCING BONDED BODY

摘要

A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate (11), an oxide layer (31) is formed on the surface of the ceramic substrate (11) between the copper sheet and the ceramic substrate (11), and the thickness of aAg-Cu eutectic structure layer (32) is set to 15 µm or less.