The present invention relates to an additive for preventing electrochemical migration of wiring, and a method for preventing an electrochemical migration of wiring by using such an additive. When the solution added with the ECM prevention additive proposed in the present invention was compared with the existing solution, it was confirmed that the ECM time was increased by suppressing the formation of dendritic tablets. Reliability of a semiconductor device can be improved by mixing the additives proposed in the present invention with a polymer material such as Epoxy Molding Compound (EMC) or Underfill used for packaging semiconductors, or by adding them to metal wiring. .
展开▼
