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- CHEMISTRY COMPATIBLE COATING MATERIAL FOR ADVANCED DEVICE ON-WAFER PARTICLE PERFORMANCE
- CHEMISTRY COMPATIBLE COATING MATERIAL FOR ADVANCED DEVICE ON-WAFER PARTICLE PERFORMANCE
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机译:-用于高级设备晶圆上颗粒性能的化学兼容涂层材料
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摘要
To fabricate a coating for an article for a semiconductor processing chamber, the article comprises a body of at least one of Al, Al 2 O 3 , or SiC, and a ceramic coating on the body. The ceramic coating comprises Y 2 O 3 in the range of about 50 mol% to about 75 mol%, ZrO 2 in the range of about 10 mol% to about 30 mol%, and Al 2 O 3 in the range of about 10 mol% to about 30 mol%. Included compounds include, wherein the number of nodules per inch ranges from about 30 nodules to about 45 nodules, and the porosity ranges from about 2.5% to about 3.2%.
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机译:为了制造用于半导体处理室的制品的涂层,该制品包括Al,Al 2 Sub> O 3 Sub>或SiC中的至少一种的主体和陶瓷。涂层在身体上。陶瓷涂层包含在约50mol%至约75mol%范围内的Y 2 Sub> O 3,在约≤Sub范围内的ZrO 2。 10mol%至约30mol%,并且Al 2 Sub> O 3 Sub>在约10mol%至约30mol%的范围内。包括的化合物包括,其中每英寸的结节数范围为约30个结节至约45个结节,并且孔隙率范围为约2.5%至约3.2%。
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